An integrated instrumentation system includes a body comprising a thermal protection system (TPS) material (e.g., an ablatable material), one or more sensors embedded within the body, and a processor (e.g., an FPGA or the like) communicatively coupled to the plurality of sensors. The processor is configured to acquire sensor signals from the plurality of sensors and produce digital sensor data associated therewith. The sensors may include, for example, recession sensors, pressure transducers, thermocouples, and accelerometers.
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